The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 08, 2013
Applicant:

Marvell World Trade Ltd., St. Michael, BB;

Inventors:

Sehat Sutardja, Los Altos Hills, CA (US);

Albert Wu, Palo Alto, CA (US);

Hyun J Shin, Palo Alto, CA (US);

Assignee:

Marvell World Trade Ltd., St. Michael, BB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H01L 21/4832 (2013.01); H01L 21/568 (2013.01); H05K 1/182 (2013.01); H01L 23/3107 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/4809 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49146 (2015.01);
Abstract

In an embodiment, there is provided a method of creating a package, the method comprising: providing an initial substrate, wherein the initial substrate comprises a carrier foil, a functional copper foil, and an interface release layer between the carrier foil and the functional copper foil; building up copper portions on the functional copper foil; attaching a chip to a first copper portion; coupling the chip to a second copper portion; encapsulating at least the chip and the copper portions with a mold; and removing the carrier foil and interface release layer.


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