The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Jul. 27, 2015
Applicant:
Kyocera Circuit Solutions, Inc., Kyoto, JP;
Inventor:
Yoshihiro Nakagawa, Osaka, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/0296 (2013.01); H05K 1/112 (2013.01); H05K 1/117 (2013.01); H05K 7/10 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/10674 (2013.01);
Abstract
In the wiring board of the present invention, the land pattern for power supply, connected to the semiconductor element connection pad for power supply through a via conductor and arranged below the segment region, includes a strip-shaped continued portion in the position corresponding to the outer peripheral portion except the outer peripheral side of the mounting portion in the segment region, and the strip-shaped continued portion and the power supply plane arranged therebelow are connected through a via conductor.