The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Feb. 02, 2015
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Masato Nomiya, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H05K 1/025 (2013.01); H05K 1/0237 (2013.01); H05K 1/0306 (2013.01); H05K 1/092 (2013.01); H05K 3/0067 (2013.01); H05K 3/12 (2013.01); H05K 3/4629 (2013.01); H05K 1/162 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0352 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09736 (2013.01);
Abstract

The electronic component of this invention includes a multilayer ceramic substratecomposed of a plurality of ceramic layers. A wiring electrodeand a planar electrodeare formed on a ceramic layer, which is an insulating layer. The planar electrodeis formed so as to be spaced apart from the wiring electrodeat the certain interval. An edge portionis formed in a region of the planar electrodeadjacent to and spaced apart from the wiring electrodeat a certain interval. A central portionis formed in a region of the planar electrodeother than the edge portion. At least the composition of the central portionis different from the composition of the wiring electrode, and the composition of the edge portionis the same as the composition of the wiring electrode


Find Patent Forward Citations

Loading…