The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Jun. 11, 2015
Automated Assembly Corporation, Lakeville, MN (US);
Robert Neuman, Cannon Falls, MN (US);
Scott Lindblad, Lakeville, MN (US);
Automated Assembly Corporation, Lakeville, MN (US);
Abstract
A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.