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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9564870 B1

PDFFull Text
Date of Patent:
Feb. 07, 2017

Filed:

Mar. 28, 2013

Structural body and wiring board

Applicant:

Nec Corporation, Tokyo, JP;

Inventors:

Yoshiaki Kasahara, Tokyo, JP;

Hiroshi Toyao, Tokyo, JP;

Assignee:

NEC CORPORATION, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Robert Pascal

Assistant Examiner:

Rakesh Patel

Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 3/08 (2006.01); H03H 7/01 (2006.01); H01P 1/20 (2006.01); H01Q 15/00 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0161 (2013.01); H01P 1/203 (2013.01); H01P 1/2005 (2013.01); H01P 3/08 (2013.01); H01Q 15/008 (2013.01); H01Q 15/0066 (2013.01); H03H 7/0115 (2013.01); H05K 1/0236 (2013.01); H05K 1/162 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09781 (2013.01);
Abstract

A second conductor plane () is formed in a layer different from a layer in which a first conductor plane () is formed, and faces the first conductor plane (). A first transmission line () is formed in a layer different from the layers in which the first conductor plane () and the second conductor plane () are formed, and faces the second conductor plane (), and one end thereof is an open end. A conductor via () connects the other end of the first transmission line () and the first conductor plane (). An insular conductor () is connected to a portion of the first transmission line () other than a portion thereof at which the transmission line () is attached to the conductor via (), is located in a layer different from the layer in which the second conductor plane () is located, and faces the second conductor plane ().

Find Patent Forward Citations

Kasahara, Yoshiaki. (2017). Structural body and wiring board (U.S. Patent No. 9564870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9564870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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