The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Oct. 20, 2015
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Go Sakaino, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/227 (2006.01); H01S 5/026 (2006.01); H01S 5/12 (2006.01); H01S 5/22 (2006.01); H01S 5/30 (2006.01); H01S 5/32 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
H01S 5/2275 (2013.01); H01S 5/026 (2013.01); H01S 5/12 (2013.01); H01S 5/2222 (2013.01); H01S 5/2224 (2013.01); H01S 5/3054 (2013.01); H01S 5/3211 (2013.01); H01S 5/34306 (2013.01); H01S 5/34366 (2013.01); H01S 2301/17 (2013.01);
Abstract

An upper cladding layer includes a first low carrier concentration layer having a lower carrier concentration than the p-type cladding layer and a first Fe-doped semiconductor layer formed on the first low carrier concentration layer. The leakage current suppression layer includes a second Fe-doped semiconductor layer disposed on a side of the p-type semiconductor layer. The first low carrier concentration layer has a side wall part that is in contact with a side face of the p-type cladding layer. The first Fe-doped semiconductor layer is disposed on a side of the p-type cladding layer via the side wall part of the first low carrier concentration layer and is not in contact with the p-type cladding layer.


Find Patent Forward Citations

Loading…