The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 21, 2015
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Automotive Systems Inc., Shiga, JP;

Inventors:

Saburo Yagi, Tokyo, JP;

Takashi Shigematsu, Tokyo, JP;

Masaya Satou, Tokyo, JP;

Shinya Kojima, Tokyo, JP;

Akira Tachibana, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/05 (2006.01); H01R 4/18 (2006.01); B23K 26/24 (2014.01); H01R 43/02 (2006.01); H01R 43/048 (2006.01); H01R 4/20 (2006.01); H01R 43/00 (2006.01);
U.S. Cl.
CPC ...
H01R 4/187 (2013.01); B23K 26/0344 (2015.10); B23K 26/24 (2013.01); H01R 4/183 (2013.01); H01R 43/0221 (2013.01); H01R 43/048 (2013.01); H01R 4/206 (2013.01); H01R 43/005 (2013.01); H01R 2201/26 (2013.01); Y10T 29/49215 (2015.01);
Abstract

A method for manufacturing a crimp terminal having a crimp portion that allows crimp connection to a conductor part of a coated wire includes forming a tubular body by bringing together side edges of a plate material made of metal composed of a copper alloy having a copper content ratio of greater than or equal to 70%, irradiating a periphery of the sides edges, which are brought together, with laser light from a laser irradiation unit to weld the side edges which are brought together, and setting a power density of the laser light and a sweep rate of the laser light in such a manner that a weld bead formed at the side edge portion after the welding has a width of 80 μm to 390 μm.


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