The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

May. 30, 2014
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Masahiro Kondo, Sakura, JP;

Kohki Ishikawa, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/18 (2006.01); H01R 13/405 (2006.01); H01R 4/70 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
H01R 4/183 (2013.01); H01R 4/70 (2013.01); H01R 13/405 (2013.01); B29C 45/14639 (2013.01); B29K 2995/0097 (2013.01); H01R 4/185 (2013.01);
Abstract

A terminal structure includes: a terminal portion including a tip of a covered electric wire; a connection terminal having a crimp portion crimped to the terminal portion; and a mold resin of a hygroscopic reactive type covering the terminal portion and the crimp portion. The crimp portion includes a conductive crimp portion crimped to the tip. The mold resin includes a first portion covering the conductive crimp portion and the tip; a second portion covering a part of the connection terminal which is further toward a tip than the tip, the part having a thickness smaller than the conductive crimp portion; and a first step formed between the first portion and the second portion such that the height of the mold resin decreases from the first portion to the second portion. A first recess formed on the second portion.


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