The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

May. 16, 2016
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Yukie Suzuki, Isehara, JP;

Yasuyuki Arai, Atsugi, JP;

Shunpei Yamazaki, Setagaya, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01Q 9/04 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 27/088 (2006.01); H01M 10/04 (2006.01); H01M 10/46 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); G06K 19/07745 (2013.01); G06K 19/07749 (2013.01); G06K 19/07786 (2013.01); H01L 23/66 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01Q 1/2208 (2013.01); H01Q 1/2283 (2013.01); H01Q 23/00 (2013.01); H01L 27/088 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3011 (2013.01); H01M 10/0436 (2013.01); H01M 10/465 (2013.01); H01M 2220/30 (2013.01);
Abstract

It is an object to provide a wireless chip which can increase a mechanical strength, and a wireless chip with a high durability. A wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, and a conductive layer connecting the chip and the antenna. Further, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a sensor device, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the sensor device. Moreover, a wireless chip includes a transistor including a field-effect transistor, an antenna including a dielectric layer sandwiched between conductive layers, a battery, a conductive layer connecting the chip and the antenna, and a conductive layer connecting the chip and the battery.


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