The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 28, 2013
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventor:

Yu-Sik Hwang, Yongin-si, KR;

Assignee:

Samsung SDI Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/42 (2006.01); H05K 3/20 (2006.01); H01M 2/04 (2006.01);
U.S. Cl.
CPC ...
H01M 10/4257 (2013.01); H01M 2/0473 (2013.01); H01M 2/0478 (2013.01); H01M 10/425 (2013.01); H05K 3/202 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/10037 (2013.01); H05K 2203/302 (2013.01); Y10T 29/49108 (2015.01);
Abstract

A protection circuit module (PCM) integrated cap assembly includes a cap plate including an electrically conductive material and defining a through hole passing from a first surface of the cap plate to a second surface of the cap plate, a wiring unit including an electrically conductive material and a circuit pattern, and facing the first surface of the cap plate, wherein a first edge of the wiring unit is electrically coupled to the cap plate, and wherein a second edge of the wiring unit extends through the through hole of the cap plate a first insulating unit in a space of the circuit pattern a second insulating unit between the second edge of the wiring unit and a portion of the cap plate defining the through hole, and at least one electrical component coupled to the circuit pattern.


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