The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Mar. 08, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Jun Seok Park, Gwangju, KR;
Seok Hoon Kang, Gwangju, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); B29C 45/14 (2006.01); B29C 45/34 (2006.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); B29C 45/14655 (2013.01); B29C 45/34 (2013.01); H01L 24/97 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1815 (2013.01);
Abstract
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.