The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 05, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Patrick Kromotis, Regensburg, DE;

Emanuel Hofmann, Neutraubling, DE;

Ludwig Peyker, Regensburg, DE;

Torsten Baade, Regensburg, DE;

Simone Kiener, Regensburg, DE;

Kristin Grosse, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/31 (2006.01); H01L 33/44 (2010.01); H01L 33/56 (2010.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 23/3135 (2013.01); H01L 33/44 (2013.01); H01L 33/56 (2013.01); H01L 23/24 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An optoelectronic component includes a housing having an electrically conductive first contact section, and an optoelectronic semiconductor chip arranged on the first contact section, wherein the optoelectronic semiconductor chip and the first contact section are at least partly covered by a first layer including a silicone, a second layer including SiOis arranged at a surface of the first layer, the second layer has a thickness of 10 nm to 1 μm, and a third layer is arranged above the second layer.


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