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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9564562 B1

PDFFull Text
Date of Patent:
Feb. 07, 2017

Filed:

Jun. 04, 2015

Silicone composition for sealing semiconductor

Applicant:

Momentive Performance Materials Japan Llc, Tokyo, JP;

Inventors:

Kikuo Mochizuki, Tokyo, JP;

Akira Takagi, Tokyo, JP;

Assignee:

MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Margaret Moore

Int. Cl.
CPC ...
C08G 77/08 (2006.01); H01L 33/56 (2010.01); C08L 83/04 (2006.01); C08L 83/10 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08L 83/04 (2013.01); C08L 83/10 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/80 (2013.01);
Abstract

The silicone composition for sealing a semiconductor, comprises: (A) 100 parts of a polyorganosiloxane having one or more alkenyl groups, obtained by reacting (a1) 60 to 99 parts of an organosiloxane containing at least a trifunctional siloxane unit not taking part in a hydrosilylation reaction, with (a2) 40 to 1 parts of an organosiloxane containing a bifunctional siloxane unit having an alkenyl group and/or a monofunctional siloxane unit having an alkenyl group; (B) an amount of a polyorganohydrogensiloxane having two or more hydrogen atoms having a viscosity at 25° C. of 1 to 1000 mPa·s so that an amount of the hydrogen atoms is 0.5 to 3.0 mol per mol of the alkenyl groups; and (C) a platinum-based catalysts, wherein a decrease in storage modulus of a cured product thereof from 25° C. to 50° C. is 40% or more. Specifically the polyorganosiloxane (A) is prepared by block or graft polymerization and equilibration reaction of three specific, different, organosiloxanes including a branched siloxane, a linear siloxane and a cyclic siloxane.

Find Patent Forward Citations

Mochizuki, Kikuo. (2017). Silicone composition for sealing semiconductor (U.S. Patent No. 9564562). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9564562

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