The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Sep. 09, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jae-Bum Byun, Suwon-si, KR;
Cheol Kwon, Suwon-si, KR;
Jong-Yun Yun, Yongin-si, KR;
Do-Il Kong, Hwaseong-si, KR;
Sung-Chul Hur, Yongin-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01); H01L 23/433 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/38 (2013.01); H01L 23/427 (2013.01); H01L 23/4334 (2013.01); H01L 23/49822 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.