The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jul. 08, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/4853 (2013.01); H01L 21/76834 (2013.01); H01L 21/78 (2013.01); H01L 23/49844 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 2224/036 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0569 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/116 (2013.01); H01L 2224/1145 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/2064 (2013.01);
Abstract

A semiconductor device having a terminal site () including a flat pad () of a first metal covered by a layer () of dielectric material, the layer over the pad parallel to the pad and having a window of a first diameter () exposing the surface of the underlying pad. The terminal site further has a patch-shaped film () of a second metal covering the surface of the exposed first metal and the surface of an annulus of the dielectric layer framing the window, the film patch having a second diameter () greater than the first diameter; and a bump () of a third metal adhering to the film, the bump having a third diameter () smaller than the second diameter, whereby the film protrudes like a flange from the bump.


Find Patent Forward Citations

Loading…