The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Apr. 30, 2015
Applicant:

Deere & Company, Moline, IL (US);

Inventors:

Christopher J. Schmit, Fargo, ND (US);

Brij N. Singh, West Fargo, ND (US);

Assignee:

DEERE & COMPANY, Moline, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/043 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/043 (2013.01); H01L 23/10 (2013.01); H01L 23/3675 (2013.01); H01L 23/564 (2013.01);
Abstract

A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.


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