The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Dec. 29, 2014
Applicant:

Sensata Technologies (Changzhou) Co., Ltd.;

Inventors:

Tianshun Wu, Shanghai, CN;

Chengwei Huang, Shanghai, CN;

Xiaochi Xu, Shanghai, CN;

Assignee:

SENSATA TECHNOLOGIES, INC., Attleboro, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A47B 91/00 (2006.01); H01L 21/68 (2006.01); H01L 21/673 (2006.01); G01P 1/02 (2006.01); G01P 3/488 (2006.01); G01D 11/24 (2006.01); G01D 11/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); G01D 11/245 (2013.01); G01D 11/30 (2013.01); G01P 1/026 (2013.01); G01P 3/488 (2013.01); H01L 21/67353 (2013.01);
Abstract

A positioning frame structure for the centering and positioning of an IC is disclosed, in which the positioning frame structure comprises an IC carrier having a first chamber defined therein and an IC positioning magnet disposed in the first chamber of the IC carrier. The positioning frame structure further comprises an IC holder disposed over the IC positioning magnet, and the IC is held on the IC holder, so as to provide centering and positioning of the IC relative to the IC positioning magnet. The present invention can be used to control the centering and positioning of the IC and the positioning magnet on the carrier. The positioning magnet can be made to be larger than the IC. In addition, a large air gap can be obtained so as to facilitate the subsequent operation of the IC. Furthermore, without the operation using adhesive, the technical solution of the present invention saves the cost of operation.


Find Patent Forward Citations

Loading…