The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Feb. 17, 2016
International Business Machines Corporation, Armonk, NY (US);
King Abdulaziz City for Science and Technology, Riyadh, SA;
Stephen W. Bedell, Wappingers Falls, NY (US);
Keith E. Fogel, Hopewell Junction, NY (US);
Paul A. Lauro, Brewster, NY (US);
Ning Li, White Plains, NY (US);
Devendra K. Sadana, Pleasantville, NY (US);
Katherine L. Saenger, Ossining, NY (US);
Ibrahim Alhomoudi, Alhufof, SA;
International Business Machines Corporation, Armonk, NY (US);
KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY, Riyadh, SA;
Abstract
Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.