The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Nov. 24, 2014
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Yoichi Hitomi, Sakado, JP;
Shinji Kumon, Kitamoto, JP;
Terutoshi Momose, Higashimatsuyama, JP;
Katsuya Sakayori, Kamifukuoka, JP;
Kiyohiro Takachi, Tsukuba, JP;
Yoichi Miura, Kawagoe, JP;
Tsuyoshi Yamazaki, Saitama, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10/% RH and 30×10/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10/% RH or less.