The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Aug. 14, 2014
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Mark Thomas McCormack, Livermore, CA (US);

Anthony Allen Fischer, Redmond, WA (US);

Raj Master, San Jose, CA (US);

Farah Shariff, Kirkland, WA (US);

Dennis Tom, Redmond, WA (US);

Zulfiqar Alam, Redmond, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H02B 1/04 (2006.01); G06F 1/16 (2006.01); C25D 7/00 (2006.01); C25D 3/50 (2006.01); C25D 3/62 (2006.01); C25D 5/10 (2006.01); H01R 13/03 (2006.01);
U.S. Cl.
CPC ...
G06F 1/163 (2013.01); C25D 3/50 (2013.01); C25D 3/62 (2013.01); C25D 5/10 (2013.01); C25D 7/00 (2013.01); G06F 1/1684 (2013.01); H01R 13/03 (2013.01);
Abstract

An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.


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