The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Mar. 16, 2016
Applicant:

Uniled Lighting Tw., Inc., New Taipei, TW;

Inventors:

Po-Cheng Yang, Taipei, TW;

Ming-Yao Lin, New Taipei, TW;

Ming-Te Lin, New Taipei, TW;

Assignee:

UNILED LIGHTING TW., INC., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); F21K 99/00 (2016.01); F21V 29/70 (2015.01); F21V 3/00 (2015.01); F21V 5/00 (2015.01); F21Y 101/02 (2006.01); F21Y 111/00 (2016.01);
U.S. Cl.
CPC ...
F21K 9/135 (2013.01); F21K 9/1355 (2013.01); F21V 3/00 (2013.01); F21V 5/007 (2013.01); F21V 29/70 (2015.01); F21Y 2101/02 (2013.01); F21Y 2111/004 (2013.01);
Abstract

A low profile LED lamp bulb with high efficient heat dissipation is disclosed. Each of the lead frame unit has a top-down tapered metal section on bottom end adaptive for being bent inwards to form a lead frame bottom cup suitable for fitting in the low profile LED lamp. A modification embodiment is that a heat sink independent from electrode is attached to a backside of the lead frame with nonconductive adhesive material, heat and electricity are independent from with each other, so that no interference between heat and electricity, and heat can be dissipated mainly from the heat sink.


Find Patent Forward Citations

Loading…