The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Jun. 24, 2014
Applicant:
Ppg Industries Ohio, Inc., Cleveland, OH (US);
Inventors:
David B. Asay, Freeport, PA (US);
Tien-Chieh Chao, Mars, PA (US);
Umesh C. Desai, Wexford, PA (US);
Cheng-Hung Hung, Wexford, PA (US);
Masayuki Nakajima, Wesford, PA (US);
Noel R. Vanier, Wesford, PA (US);
Assignee:
PPG Industries Ohio, Inc., Cleveland, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/04 (2006.01); B82Y 30/00 (2011.01); C09J 5/00 (2006.01); C08G 59/42 (2006.01); C09J 163/00 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); B82Y 30/00 (2013.01); C08G 59/4215 (2013.01); C09J 5/00 (2013.01); C09J 163/00 (2013.01); C08K 3/04 (2013.01);
Abstract
Disclosed herein are adhesive compositions comprising (a) a first component; (b) a second component that chemically reacts with said first component; and (c) graphenic carbon particles having an oxygen content of no more than 2 atomic weight percent. Disclosed herein are associated methods for forming the adhesive compositions and applying the adhesive compositions to a substrate to form a bonded substrate.