The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Jan. 23, 2012
Applicants:

Ludwik Leibler, Paris, FR;

Francois Tournilhac, Paris, FR;

Damien Montarnal, Bourgoin-Jallieu, FR;

Mathieu Capelot, Serquigny, FR;

Inventors:

Ludwik Leibler, Paris, FR;

Francois Tournilhac, Paris, FR;

Damien Montarnal, Bourgoin-Jallieu, FR;

Mathieu Capelot, Serquigny, FR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08G 59/68 (2006.01); B29B 17/00 (2006.01); B29B 17/04 (2006.01); C08G 59/42 (2006.01); C08L 63/00 (2006.01); B29K 101/10 (2006.01);
U.S. Cl.
CPC ...
C08G 59/685 (2013.01); B29B 17/0042 (2013.01); B29B 17/0404 (2013.01); C08G 59/42 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); B29K 2101/10 (2013.01); Y02W 30/62 (2015.05); Y02W 30/625 (2015.05);
Abstract

Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.


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