The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2017
Filed:
Jul. 02, 2012
Applicants:
Sampath K. Vanimisetti, Karnataka, IN;
Chen-shih Wang, Troy, MI (US);
Inventors:
Sampath K. Vanimisetti, Karnataka, IN;
Chen-Shih Wang, Troy, MI (US);
Assignee:
GM Global Technology Operations LLC, Detroit, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/14 (2006.01); B29C 65/00 (2006.01); B32B 7/12 (2006.01); B29C 65/48 (2006.01); B29C 65/78 (2006.01); C09J 5/06 (2006.01); H05B 6/70 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/36 (2006.01); B32B 3/04 (2006.01); F16B 11/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/91951 (2013.01); B29C 65/1425 (2013.01); B29C 65/4835 (2013.01); B29C 65/787 (2013.01); B29C 66/1122 (2013.01); B29C 66/43 (2013.01); B29C 66/721 (2013.01); B29C 66/863 (2013.01); B29C 66/91443 (2013.01); B32B 3/04 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/36 (2013.01); C09J 5/06 (2013.01); H05B 6/701 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/7392 (2013.01); B29C 66/73112 (2013.01); B29C 66/73921 (2013.01); B29C 66/742 (2013.01); B29C 66/74283 (2013.01); B29C 66/919 (2013.01); B29C 66/91411 (2013.01); B29C 66/91631 (2013.01); B29C 66/949 (2013.01); B32B 2262/0253 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2262/105 (2013.01); B32B 2605/00 (2013.01); C09J 2205/31 (2013.01); F16B 11/006 (2013.01); Y10T 428/19 (2015.01);
Abstract
A method and apparatus to mitigate the severity of the bond-line read-out defect, and more specifically microwave heating to locally cure adhesive bond-line in a single or two stage process comprising heating thermoset adhesive with microwave radiation until the adhesive is fully cured or partially cured. If the adhesive is partially cured, it can be fully cured by being subjected to an additional thermal cycle.