The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Feb. 28, 2012
Applicants:

Kenneth Jenkins, Port Monmouth, NJ (US);

Kevin A. Hebborn, Toms River, NJ (US);

William S. Leib, Iii, Tinton Falls, NJ (US);

David Weimer, Tuckerton, NJ (US);

Inventors:

Kenneth Jenkins, Port Monmouth, NJ (US);

Kevin A. Hebborn, Toms River, NJ (US);

William S. Leib, III, Tinton Falls, NJ (US);

David Weimer, Tuckerton, NJ (US);

Assignee:

Dialight Corporation, Farmingdale, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 39/10 (2006.01); H05K 5/06 (2006.01); B29K 675/00 (2006.01); B29K 683/00 (2006.01);
U.S. Cl.
CPC ...
B29C 39/10 (2013.01); H05K 5/064 (2013.01); B29K 2675/00 (2013.01); B29K 2683/00 (2013.01); B29K 2863/00 (2013.01);
Abstract

The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.


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