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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9560791 B1

PDFFull Text
Date of Patent:
Jan. 31, 2017

Filed:

Jun. 27, 2014

Method of manufacturing heat conductive sheet, heat conductive sheet, and heat dissipation member

Applicant:

Dexerials Corporation, Shinagawa-ku, Tokyo, JP;

Inventors:

Keisuke Aramaki, Utsunomiya, JP;

Atsuya Yoshinari, Kanuma, JP;

Takuhiro Ishii, Tachikawa, JP;

Shinichi Uchida, Utsunomiya, JP;

Masahiko Ito, Nikko, JP;

Assignee:

Dexerials Corporation, Shinagawa-ku, Tokyo, JP;

Attorney:

Kenja IP Law PC

Primary Examiner:

Elizabeth Mulvaney

Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); B29C 65/00 (2006.01); B29C 69/00 (2006.01); B32B 25/08 (2006.01); B32B 27/28 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); F28F 13/18 (2006.01); F28F 21/02 (2006.01); H01L 23/433 (2006.01); H01L 21/48 (2006.01); B29K 683/00 (2006.01); B29L 31/18 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20481 (2013.01); B29C 65/002 (2013.01); B29C 66/45 (2013.01); B29C 69/001 (2013.01); B32B 25/08 (2013.01); B32B 27/283 (2013.01); B32B 37/10 (2013.01); B32B 38/0004 (2013.01); F28F 13/18 (2013.01); F28F 21/02 (2013.01); H01L 21/4871 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/433 (2013.01); H05K 7/2049 (2013.01); B29K 2683/00 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/18 (2013.01); B29L 2031/3481 (2013.01); B32B 2250/24 (2013.01); B32B 2307/302 (2013.01); B32B 2383/00 (2013.01); B32B 2457/00 (2013.01); H01L 21/4878 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16152 (2013.01);
Abstract

Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

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