The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Jul. 18, 2014
Applicant:

Materion Corporation, Mayfield Hts., OH (US);

Inventors:

Ramesh Kothandapani, Singapore, SG;

Chee Kong Lee, Singapore, SG;

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/04 (2006.01); B23K 35/02 (2006.01); H05K 5/00 (2006.01); H05K 5/03 (2006.01); H01L 23/04 (2006.01); H01S 5/022 (2006.01); B32B 38/08 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H05K 5/04 (2013.01); B23K 35/0222 (2013.01); H01L 23/04 (2013.01); H01S 5/02296 (2013.01); H05K 5/0095 (2013.01); H05K 5/03 (2013.01); B32B 38/08 (2013.01); H01L 21/50 (2013.01); H01L 2924/0002 (2013.01); Y10T 156/1052 (2015.01);
Abstract

A cap assembly for optical communications comprising a housing that includes a front side perpendicular from a bottom side, opposing parallel first and second sides perpendicular from the bottom side, and a back side disposed perpendicularly between the first side and the second side offset from respective ends of the first side and the second side opposite the front side. The back side includes an opening there-through and a three-sided ledge formed along an interior of the first side leg, an exterior of the back side, and an interior of the second side leg. The cap assembly further includes a window configured to contact the three-sided ledge of the back side, the window covering the opening there-through and attached to the assembly via a solder pre-form.


Find Patent Forward Citations

Loading…