The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9560779 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 31, 2017

Filed:

Oct. 02, 2014
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Peter Novysedlak, Spisska Nova Ves, SK;

Ondrej Hajek, Vysoke Myto, CZ;

Martin Konecny, Troubsko, CZ;

Milan Vasicek, Brno, CZ;

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01); B81B 7/00 (2006.01); G01P 1/02 (2006.01); G01D 11/24 (2006.01); G01D 3/028 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0239 (2013.01); B81B 7/0032 (2013.01); G01D 11/245 (2013.01); G01P 1/023 (2013.01); H05K 1/0212 (2013.01); H05K 5/0013 (2013.01); H05K 5/0213 (2013.01); G01D 3/028 (2013.01); H05K 2201/06 (2013.01);
Abstract

An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.


Find Patent Forward Citations

Novysedlak, Peter. (2017). Thermal stabilization of temperature sensitive components (U.S. Patent No. 9560779). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9560779

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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