The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

May. 21, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Hiromi Murayama, Nagaokakyo, JP;

Kazuaki Higashibata, Nagaokakyo, JP;

Noboru Kato, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/11 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 9/20 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); G06K 19/0772 (2013.01); G06K 19/07754 (2013.01); G06K 19/07756 (2013.01); H01L 23/49855 (2013.01); H01Q 1/2225 (2013.01); H01Q 9/20 (2013.01); H05K 1/028 (2013.01); H05K 1/0259 (2013.01); H05K 1/0295 (2013.01); H05K 1/03 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15313 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09427 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/10628 (2013.01); Y02P 70/611 (2015.11);
Abstract

A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.


Find Patent Forward Citations

Loading…