The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Feb. 04, 2016
Applicant:

TM Technology, Inc, Hsinchu, TW;

Inventors:

Ben Wu, Taipei, TW;

Wen-Doe Su, Zhubei, TW;

Assignee:

TM TECHNOLOGY, INC., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0017 (2013.01); H05K 3/4007 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10242 (2013.01); H05K 2203/0562 (2013.01);
Abstract

A light emitting diode load board includes a substrate, a first dielectric layer, a second dielectric layer and a first conductive pad and a second conductive pad. The second dielectric layer includes a first structure part, a second structure part and a third structure part. The first dielectric layer is disposed on the substrate. The first structure part is disposed on the first dielectric layer and has a first sidewall. The second structure part is disposed on the first structure part and has a second sidewall. The third structure part is disposed on the second structure part and has N sidewalls. The second sidewall is more prominent than the first sidewall. The first sidewall, the second sidewall and the N sidewalls define the first etched part, and the part of the first dielectric layer is exposed from the first etched part. The first conductive pad is disposed in the first etched part. The second conductive is disposed on the second dielectric layer, covers part of the second dielectric and exposes the open of the first etched part.


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