The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Nov. 28, 2011
Applicant:

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Inventor:

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H05K 1/02 (2006.01); B81B 7/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); B81B 7/0058 (2013.01); H05K 3/32 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A component includes a substrate having at least one flexible substrate area which has at least one area reinforced by forming a material composite. The material composite includes at least a portion of the flexible substrate area. The component also includes a first microstructured or nanostructured element and a connecting mechanism configured to attach the first microstructured or nanostructured element to the flexible substrate area. A damping mass is configured to cover at least the first microstructured or nanostructured element and a portion of the substrate protruding over the material composite. The component is configured to provide a secure receptacle for the electronic element and to offer good vibration decoupling of the electronic element from vibrations of the component.


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