The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Apr. 29, 2013
Applicant:
Taiyo Yuden Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
TAIYO YUDEN CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0253 (2013.01); H05K 1/0225 (2013.01); H05K 1/0228 (2013.01); H05K 1/185 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09236 (2013.01);
Abstract
A multilayer circuit substrate obtained by alternately stacking conductor layers and insulator layers. The conductor layers include a core layer having a greater thickness than any of the other conductor layers and located in an inner layer of the multilayer circuit substrate. A first conductor layer facing the core layer through an insulator layer has first signal wires that transmit high frequency signals, and through-holes are formed in the core layer along the first signal wires in a location facing the first signal wires.