The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Mar. 25, 2014
Applicant:

The Hong Kong University of Science and Technology, Hong Kong, CN;

Inventors:

Chik Patrick Yue, Hong Kong, CN;

Johnny Kin On Sin, Hong Kong, CN;

Kei May Lau, Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H05B 37/02 (2006.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); F21V 29/70 (2015.01); F21V 5/00 (2015.01); F21V 9/00 (2015.01); G08G 1/07 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01L 33/64 (2010.01); H05B 33/08 (2006.01); H01L 27/15 (2006.01); F21W 131/103 (2006.01);
U.S. Cl.
CPC ...
H05B 37/0227 (2013.01); F21V 5/004 (2013.01); F21V 9/00 (2013.01); F21V 29/70 (2015.01); G08G 1/07 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 25/0753 (2013.01); H01L 25/16 (2013.01); H01L 25/167 (2013.01); H01L 27/153 (2013.01); H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H05B 33/0854 (2013.01); H05B 37/0218 (2013.01); H05B 37/0272 (2013.01); F21W 2131/103 (2013.01); F21Y 2115/10 (2016.08); H01L 27/156 (2013.01); H01L 2224/16 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A lighting device is provided. The lighting device includes a substrate, integrated circuits (), embedded passive components (), and a lighting component (), the device being arranged in an architecture having three layers: an integrated circuits layer () including the integrated circuits (), wherein the integrated circuits layer () is integrated on a first side of the substrate; an embedded passive components layer () including the embedded passive components (), wherein the embedded passive components () are embedded in grooves formed in the substrate and wherein the embedded passive components are connected to the integrated circuits () through vias () in the substrate; and a bonded layer (), including the lighting component (), the lighting component () being connected to the integrated circuit layer () through flip-chip bonding or monolithic integration.


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