The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Jul. 22, 2009
Applicants:

Monika Junghans, Hamburg, DE;

Bernd Dietz, Ammersbek, DE;

Frank Domann, Uetersen, DE;

Udo Dominikat, Wees, DE;

Klaus Keite-telgenbüscher, Hamburg, DE;

Ute Ellringmann, Hamburg, DE;

Inventors:

Monika Junghans, Hamburg, DE;

Bernd Dietz, Ammersbek, DE;

Frank Domann, Uetersen, DE;

Udo Dominikat, Wees, DE;

Klaus Keite-Telgenbüscher, Hamburg, DE;

Ute Ellringmann, Hamburg, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/22 (2006.01); B32B 3/24 (2006.01); B32B 7/10 (2006.01); B32B 15/02 (2006.01); B32B 15/04 (2006.01); H05B 3/34 (2006.01); H05B 3/36 (2006.01); H05B 3/38 (2006.01); H01C 7/02 (2006.01); C09J 9/02 (2006.01); C09J 7/00 (2006.01); A61K 9/70 (2006.01); A61K 50/00 (2006.01); H05B 3/84 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 3/26 (2006.01); B32B 15/16 (2006.01); A61K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05B 3/34 (2013.01); H05B 3/845 (2013.01); A61K 9/0009 (2013.01); A61K 9/703 (2013.01); B32B 3/22 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/16 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2264/108 (2013.01); B32B 2307/30 (2013.01); B32B 2307/704 (2013.01); C09J 7/00 (2013.01); C09J 9/02 (2013.01); C09J 2203/30 (2013.01); H01C 7/021 (2013.01); H01C 7/027 (2013.01); H05B 3/36 (2013.01); H05B 3/38 (2013.01); H05B 2203/006 (2013.01); H05B 2203/013 (2013.01); H05B 2203/017 (2013.01); H05B 2203/02 (2013.01); H05B 2214/04 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24149 (2015.01); Y10T 428/24314 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24917 (2015.01); Y10T 428/26 (2015.01); Y10T 428/265 (2015.01); Y10T 428/28 (2015.01); Y10T 428/2804 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/2852 (2015.01);
Abstract

A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.


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