The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Jul. 13, 2015
Applicant:

Volterra Semiconductor Llc, San Jose, CA (US);

Inventors:

Alexandr Ikriannikov, Castro Valley, CA (US);

Andrew J. Burstein, Pleasanton, CA (US);

Anthony J. Stratakos, Kentfield, CA (US);

Assignee:

Volterra Semiconductor, LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/0412 (2006.01); H01F 27/28 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01F 17/00 (2006.01); H02M 3/158 (2006.01);
U.S. Cl.
CPC ...
H03K 17/0412 (2013.01); H01F 27/2804 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H02M 3/158 (2013.01); H02M 3/1582 (2013.01); H01F 2017/0086 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/18161 (2013.01);
Abstract

An integrated circuit includes a semiconductor die including one or more switching circuits, a magnetic core having length and width, first and second metallic leads, and integrated circuit packaging material. The first metallic lead forms a first winding turn around a portion of the magnetic core, and the first metallic lead is electrically coupled to the semiconductor die. The second metallic lead forms a second winding turn around a portion of the magnetic core. The first and second winding turns are offset from each other along both of the width and length of the magnetic core. The integrated circuit is, for example, included in an integrated electronic assembly.


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