The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Jun. 09, 2015
Applicant:
Sae Magnetics (H.k.) Ltd., Hong Kong, HK;
Inventors:
Assignee:
SAE Magnetics (H.K.) Ltd., Hong Kong, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/564 (2013.01); H04B 10/079 (2013.01); H04B 10/50 (2013.01); H01S 5/068 (2006.01); H01S 5/022 (2006.01); H01S 5/042 (2006.01); H01S 5/0683 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01L 31/105 (2006.01); H01S 5/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/06808 (2013.01); H01L 31/1055 (2013.01); H01S 5/005 (2013.01); H01S 5/02248 (2013.01); H01S 5/02276 (2013.01); H01S 5/042 (2013.01); H01S 5/0425 (2013.01); H01S 5/0683 (2013.01); H01S 5/183 (2013.01); H01S 5/423 (2013.01); H04B 10/07955 (2013.01); H04B 10/503 (2013.01); H04B 10/564 (2013.01);
Abstract
A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.