The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Sep. 29, 2011
Applicants:
Kamala Rajan, Ewing, NJ (US);
Emory Krall, Ewing, NJ (US);
Prashant Mandlik, Ewing, NJ (US);
Ruiqing MA, Ewing, NJ (US);
Peter Levermore, Ewing, NJ (US);
Huiqing Pang, Ewing, NJ (US);
Jeffrey Silvernail, Ewing, NJ (US);
Inventors:
Kamala Rajan, Ewing, NJ (US);
Emory Krall, Ewing, NJ (US);
Prashant Mandlik, Ewing, NJ (US);
Ruiqing Ma, Ewing, NJ (US);
Peter Levermore, Ewing, NJ (US);
Huiqing Pang, Ewing, NJ (US);
Jeffrey Silvernail, Ewing, NJ (US);
Assignee:
Universal Display Corporation, Ewing, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 35/24 (2006.01); H01L 51/00 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); F21S 6/00 (2006.01); H01R 12/61 (2011.01); H01R 13/717 (2006.01); H01L 51/52 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H01L 27/32 (2006.01); F21Y 105/00 (2016.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); F21S 6/003 (2013.01); H01L 51/52 (2013.01); H01R 12/61 (2013.01); H01R 13/7175 (2013.01); H05K 1/147 (2013.01); H05K 1/189 (2013.01); F21Y 2105/00 (2013.01); F21Y 2115/15 (2016.08); H01L 27/3202 (2013.01); H01L 27/3204 (2013.01); H01L 2251/5361 (2013.01); H05K 1/028 (2013.01); H05K 3/284 (2013.01); H05K 3/361 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/209 (2013.01); H05K 2201/2072 (2013.01); Y02E 10/549 (2013.01);
Abstract
Devices including multiple flexible substrates bearing organic light-emitting diodes (OLEDs) are provided. The flexible substrates are interconnected, and the properties of the substrates and the interconnections provide the shape of the device.