The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

May. 02, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sameer Pendharkar, Allen, TX (US);

Naveen Tipirneni, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/338 (2006.01); H01L 27/02 (2006.01); H01L 29/20 (2006.01); H01L 29/267 (2006.01); H01L 29/778 (2006.01); H01L 49/02 (2006.01); H01L 29/10 (2006.01); H01L 21/8252 (2006.01); H01L 27/06 (2006.01); H01L 21/8232 (2006.01); H01L 29/201 (2006.01); H01L 29/205 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0255 (2013.01); H01L 21/8232 (2013.01); H01L 21/8252 (2013.01); H01L 27/0605 (2013.01); H01L 27/0629 (2013.01); H01L 28/20 (2013.01); H01L 29/1029 (2013.01); H01L 29/201 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/267 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01); H01L 29/7833 (2013.01);
Abstract

A method of forming a semiconductor device includes a GaN FET with an overvoltage clamping component electrically coupled to a drain node of the GaN FET and coupled in series to a voltage dropping component. The voltage dropping component is electrically coupled to a terminal which provides an off-state bias for the GaN FET. The overvoltage clamping component has a breakdown voltage less than a breakdown voltage of the GaN FET. The voltage dropping component is formed to provide a voltage drop which increases as current from the overvoltage clamping component increases. The semiconductor device is configured to turn on the GaN FET when the voltage drop across the voltage dropping component reaches a threshold value.


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