The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Mar. 18, 2013
Jae-sung Lim, Cheonan-si, KR;
Ju-hyung Kim, Seoul, KR;
Jin-wook Jeong, Asan-si, KR;
Hyun-joo Kim, Asan-si, KR;
Hyouk Lee, Seoul, KR;
Jae-Sung Lim, Cheonan-si, KR;
Ju-Hyung Kim, Seoul, KR;
Jin-Wook Jeong, Asan-si, KR;
Hyun-Joo Kim, Asan-si, KR;
Hyouk Lee, Seoul, KR;
Hana Micron, Inc., Asan-si, KR;
Abstract
An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.