The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Dec. 05, 2014
Silergy Semiconductor Technology (Hangzhou) Ltd., Hangzhou, CN;
Jiaming Ye, Hangzhou, CN;
Silergy Semiconductor Technology (Hangzhou) Ltd., Hangzhou, CN;
Abstract
A leadframe, a package assembly and methods for manufacturing the same are disclosed. A plurality of electronic devices are stacked in a plurality of levels in the package assembly. The leadframe includes a plurality of leads having interconnect areas. The plurality of leads are grouped so that the interconnect areas of each group of leads have a height corresponding to one level of electronic devices. In the package assembly, the interconnect areas of each group of leads are soldered to one level of electronic devices. The leadframe and the package assembly result in increased packaging density, less usage of bonding wires in the package assembly, and improve reliability. The method for manufacturing the package assembly reduces adverse effects of a reflow process on properties of the electronic devices, and thus further improves reliability of the package assembly.