The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Jul. 08, 2016
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Naoki Takizawa, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Abstract
A semiconductor device includes a laminated substrate having circuit boards, an insulating plate, and a metal plate laminated, and warped convexly to the circuit board side; semiconductor chips fixed to the corresponding circuit boards; a base plate having a predetermined disposition region in which the laminated substrate is disposed, grooves disposed in the outer periphery of the disposition region, and projections disposed in positions in the disposition region adjacent to and inside the grooves. The grooves has on the projection side an inclination corresponding to an inclination caused by the warp of the laminated substrate. A joining material fills the space between the metal plate and the disposition region and covers the grooves and projections.