The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Mar. 14, 2016
Applicant:

Alps Electric Co., Ltd., Ota-ku, Tokyo, JP;

Inventors:

Hideki Gocho, Tokyo, JP;

Shuji Yanagi, Tokyo, JP;

Masaya Yamatani, Tokyo, JP;

Hisayuki Yazawa, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3157 (2013.01); B81B 7/0041 (2013.01); B81B 7/0061 (2013.01); B81C 1/00293 (2013.01); B81C 1/00309 (2013.01); H01L 21/563 (2013.01); H01L 24/17 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0264 (2013.01); H01L 2224/1713 (2013.01);
Abstract

An electronic component has a circuit board with a main surface, a chip having a sensor facing the main surface, bump electrodes disposed between the main surface and the chip so as to be placed inside of the edges of the chip in a plan view of the main surface, a dam provided between the main surface and the chip so as to extend at least from the edges of the chip to outer positions of the bump electrodes in a plan view of the main surface, and an under-fill material provided at least in a clearance between the dam and the chip. Between the main surface and the sensor, a space is formed in a region enclosed by the bump electrodes in a plan view of the main surface. The under-fill material is disposed outside of the space in a plan view of the main surface.


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