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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9559028 B1

PDFFull Text
Date of Patent:
Jan. 31, 2017

Filed:

Jul. 23, 2015

Semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Hirofumi Takeda, Kyoto, JP;

Yoshihisa Takada, Kyoto, JP;

Assignee:

ROHM CO., LTD, Kyoto, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 23/13 (2006.01); G01C 17/30 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); G01C 17/30 (2013.01); H01L 23/147 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/552 (2013.01); H01L 24/97 (2013.01); H01L 25/065 (2013.01); H01L 25/50 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/11618 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/11826 (2013.01); H01L 2224/131 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13566 (2013.01); H01L 2224/13583 (2013.01); H01L 2224/13647 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10158 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15157 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device can be manufactured with a reduced cost. The semiconductor device (D) includes, a substrate (D), which includes a main surface (D) and a recess (D) depressed from the main surface (D), and includes a semiconductor material; a wiring layer (D) in which at least a portion thereof is formed on the substrate (D); one or more first elements (D) accommodated in the recess (D); a sealing resin (D) covering at least a portion of the one or more first elements (D) and filled in the recess (D); and a plurality of columnar conductive portions (D) penetrating through the sealing resin (D) in the depth direction of the recess (D), and respectively connected with the portion of the wiring layer (D) that is formed at the recess (D).

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