The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Aug. 07, 2015
Applicant:
Nichia Corporation, Anan-shi, Tokushima, JP;
Inventors:
Assignee:
NICHIA CORPORATION, Anan-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/78 (2006.01); H01L 33/48 (2010.01); H01L 33/38 (2010.01); H01L 33/36 (2010.01); H01L 33/62 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/382 (2013.01); H01L 33/385 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/405 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01);
Abstract
A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first surface of the semiconductor stacked-layer body; a resin member disposed on a first surface side of the semiconductor stacked-layer body; and a metal layer disposed in the resin member and electrically connected to the electrode. A recess is defined in an upper surface of the resin member. The metal layer is projected from the upper surface of the resin member, and is disposed to surround at least a portion of the recess.