The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Nov. 06, 2013
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 21/308 (2006.01); H01L 23/528 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76802 (2013.01); H01L 21/0334 (2013.01); H01L 21/0337 (2013.01); H01L 21/3081 (2013.01); H01L 21/311 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); H01L 21/76816 (2013.01); H01L 23/528 (2013.01); H01L 27/11521 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A pattern structure in a semiconductor device includes an extending line and a pad connected with an end portion of the extending line. The pad may have a width that is larger than a width of the extending line. The pad includes a protruding portion extending from a lateral portion of the pad. The pattern structure may be formed by simplified processes and may be employed in various semiconductor devices requiring minute patterns and pads.