The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Feb. 27, 2014
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshiko Okada, Kyoto, JP;

Atsushi Yamamoto, Kyoto, JP;

Akihiro Nakamura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01B 3/12 (2006.01); B32B 18/00 (2006.01); C04B 35/26 (2006.01); C04B 35/634 (2006.01); C04B 35/638 (2006.01); H01F 41/04 (2006.01); H05K 3/00 (2006.01); H01F 1/34 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); B32B 18/00 (2013.01); C04B 35/265 (2013.01); C04B 35/638 (2013.01); C04B 35/6342 (2013.01); H01B 3/12 (2013.01); H01F 1/344 (2013.01); H01F 17/0033 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H05K 3/0058 (2013.01); C04B 2235/3265 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/6025 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6584 (2013.01); C04B 2235/96 (2013.01); C04B 2237/06 (2013.01); C04B 2237/68 (2013.01); H01F 27/292 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A coil conductor and a via electrode placed away from the coil conductor are embedded in a magnetic layer. The magnetic layer is sandwiched between a pair of non-magnetic layers. The coil conductor and the via electrode are formed from a conductive material containing Cu as its main constituent, and the magnetic layer is formed from Ni—Mn—Zn ferrite where the CuO molar content is 5 mol % or less, and (x, y) falls within the range of A (25, 1), B (47, 1), C (47, 7.5), D (45, 7.5), E (45, 10), F (35, 10), G (35, 7.5), and H (25, 7.5) when the molar content x of FeOand the molar content y of MnOare represented by (x, y). Thus, insulation properties can be ensured, favorable electrical characteristics can be achieved, and a ceramic electronic component is achieved which is able to be reduced in size.


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