The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Apr. 04, 2012
Applicants:

Yoshihisa Warashina, Hamamatsu, JP;

Tomofumi Suzuki, Hamamatsu, JP;

Kohei Kasamori, Hamamatsu, JP;

Inventors:

Yoshihisa Warashina, Hamamatsu, JP;

Tomofumi Suzuki, Hamamatsu, JP;

Kohei Kasamori, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 26/00 (2006.01); G02B 26/08 (2006.01); G01B 9/02 (2006.01); G02B 5/08 (2006.01); G01J 3/453 (2006.01);
U.S. Cl.
CPC ...
G02B 26/001 (2013.01); G01B 9/02051 (2013.01); G01B 9/02056 (2013.01); G01J 3/4535 (2013.01); G01J 3/4537 (2013.01); G02B 5/08 (2013.01); G02B 26/0833 (2013.01);
Abstract

An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module.


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