The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Sep. 02, 2014
Applicant:

Dow Corning Corporation, Midland, MI (US);

Inventors:

Don L Kleyer, Hemlock, MI (US);

Randall G Schmidt, Midland, MI (US);

Adam C Tomasik, Mount Pleasant, MI (US);

Shengqing Xu, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5419 (2006.01); C07F 15/02 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5419 (2013.01); C07F 15/025 (2013.01); H01L 23/296 (2013.01);
Abstract

An additive for a silicone encapsulant has the structure: Formula (I) wherein Rand Rare each —O—Si(R)(R)(R) and each of R, R, and Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups, and wherein Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.


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