The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Jul. 01, 2010
Wendy Wen-ling Lin, Niskayuna, NY (US);
Wenliang Patrick Yang, Ballston Lake, NY (US);
Wendy Wen-Ling Lin, Niskayuna, NY (US);
Wenliang Patrick Yang, Ballston Lake, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A system including a dual cure composite structure is disclosed. The system also includes a first layer comprising a resin having a first and a second functional group. The system further includes a second layer comprising the resin having the first and the second functional group. The system also includes a third layer comprising the resin having the first and the second functional group. The system further includes a first covalent bond across an interface of the first and the second layer and a second covalent bond across another interface of the second and the third layer. The system further includes more than two layers comprising the resin having the first and second functional group. A method of manufacturing a system including a dual cure composite structure is also disclosed. The method includes providing a first layer comprising a resin having a first functional group and a second functional group. The method also includes applying a first curing source to partially cure the first layer. The method further includes providing a second layer comprising the resin having the first and the second functional group onto the first layer and applying a second curing source to fully cure the first layer and partially cure the second layer simultaneously.