The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2017
Filed:
Feb. 22, 2013
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
John A. Woleader, Pomona, CA (US);
Andrew R. Streett, San Clemente, CA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); F16B 11/00 (2006.01); B29L 31/30 (2006.01); B29C 65/54 (2006.01); B29C 65/00 (2006.01); B29C 37/04 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1284 (2013.01); F16B 11/006 (2013.01); B29C 37/04 (2013.01); B29C 65/542 (2013.01); B29C 66/004 (2013.01); B29C 66/1122 (2013.01); B29C 66/12441 (2013.01); B29C 66/32 (2013.01); B29C 66/342 (2013.01); B29C 66/3452 (2013.01); B29C 66/5344 (2013.01); B29C 66/53241 (2013.01); B29C 66/55 (2013.01); B29C 66/721 (2013.01); B29C 66/742 (2013.01); B29C 66/861 (2013.01); B29L 2031/3097 (2013.01); Y10T 403/477 (2015.01);
Abstract
A method of forming an injection-bonded joint may include forming a chamber wall within a bondline region between mating surfaces of a first part and a second part. The chamber wall may divide a bondline length and define at least one adhesive chamber. The method may include injecting a structural adhesive into the adhesive chamber through an injection port, and discharging excess adhesive from the adhesive chamber through a bleed hole.